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Metodi e strumenti di rilievo degli edifici esistenti

Metodi e strumenti di rilievo degli edifici esistenti.Integrazione tra fotogrammetria e termografia, dal rilievo alla diagnostica


Due to the importance of existing buildings survey phase to acquire all the technical and documental information for Building Information Modeling (BIM), it is more and more necessary to study and to test new methods that are able to produce shareable digital data. Moreover, these methods using new and advanced technologies have to be aimed to obtain more accurate and complete survey, to ensure a higher information quality and simultaneously to optimize both acquisition time on site and captured images post-processing. Taking into account that the survey phase is also connoted by a diagnostic approach in order to fill information gaps on technological characteristics and performance of buildings, it is studied how to integrate the material-geometrical survey using multi-images with thermographic imaging, which shows construction defects and possible changes over time. In fact, one of the objectives of the researches carried out by ITC – CNR, branch of Bari, is to investigate and to explore the use of the thermal images as texture of the model to get thermographic orthophotos or, otherwise, as an open information windows activated by integrated interactive areas in technical virtual tour of the building. These methodologies were applied on buildings with different type and year of construction and use by producing: digital 2D orthophotos from photogrammetric survey and, in more complex cases, by laser scanning; digital 2D models from thermographic imaging used as texture of the model; 3D digital models by laser scanning and by multi-image photogrammetry survey and technical virtual tour. The obtained results were studied by comparing the different survey methods. 

Tratto dal Convegno
Modellazione e gestione delle informazioni per il patrimonio edilizio esistente
Built Heritage Information Modelling/Management – BHIMM
Politecnico di Milano, 21/22 GIUGNO 2016


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